Description
IC TDM/PACKET TRANSPORT 676BGA Series: - Function: TDM-over-Packet (TDMoP) Interface: TDMoP Number of Circuits: 1 Voltage - Supply: 1.8V, 3.3V Current - Supply: - Power (Watts): - Operating Temperature: -40~C ~ 85~C Mounting Type: Surface Mount Package / Case: 676-BGA Supplier Device Package: 676-PBGA (27x27)
Part Number | DS34S132GN |
Main Category | Integrated Circuits (ICs) |
Sub Category | Interface - Telecom |
Brand | Maxim |
Description | IC TDM OVER PACKET 676-BGA |
Series | - |
Packaging | Tray |
Function | TDM-over-Packet (TDMoP) |
Interface | TDMoP |
Number of Circuits | 1 |
Voltage - Supply | 1.8V, 3.3V |
Current - Supply | - |
Power (Watts) | - |
Operating Temperature | -40°C ~ 85°C |
Mounting Type | Surface Mount |
Package / Case | 676-BGA |
Supplier Device Package | 676-PBGA (27x27) |
Image |
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