Description
IC TDM/PACKET CHIP 484-BGA Series: - Type: TDM (Time Division Multiplexing) Applications: Data Transport Mounting Type: Surface Mount Package / Case: 484-BGA Supplier Device Package: 484-TEBGA (23x23)
Part Number | DS34T102GN |
Main Category | Integrated Circuits (ICs) |
Sub Category | Specialized ICs |
Brand | Maxim |
Description | IC TDM/PACKET CHIP 484-BGA |
Series | - |
Packaging | Tray |
Type | TDM (Time Division Multiplexing) |
Applications | Data Transport |
Mounting Type | Surface Mount |
Package / Case | 484-BGA |
Supplier Device Package | 484-TEBGA (23x23) |
Image |
DS34T102GN
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600
0.53
HK HEQING ELECTRONICS LIMITED
DS34T102GN
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3000
1.335
HONG KONG YUE JIN PENG ELECTRONICS CO.
DS34T102GN
MAXMI
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ATLANTIC TECHNOLOGY LIMITED
DS34T102GN
MXAIM
23640
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Mlccbase Manufacturing Ltd
DS34T102GN
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11252
3.75
Ande Electronics Co., Limited