Description
l ead fr ee, b ul k. T2855-3. MAX2016ETI +TD -40 C to +85 C. 28 Thi n QFN - E P *, l ead fr ee, T/R. T2855-3. *EP = Exposed pad. +Indicates lead-free package. Product Content Information for: MAX2016ETI -T. Links. Qualifications. Package Description. Chemical Composition Summary. Detailed Package Component Product Content Information for: MAX2016ETI +T. Links. Qualifications. Package Description. Chemical Composition Summary. Detailed Package Component MAX2016ETI . . 1. PCB: MAX2016EVKIT. Component List. The exposed paddle conductor on U1 must be solder-attached to a grounded pad on the PCB to MAX2016ETI +TD -40 C to +85 C. 28 Thi n QFN - E P *, l ead fr ee, T/R. T2855-3. * EP = . = . D = .
Part Number | MAX2016ETI |
Main Category | RF-IF and RFID |
Sub Category | RF Detectors |
Brand | Maxim |
Description | IC DETECT/CNTRL LOG 28-TQFN |
Series | - |
Packaging | Tube |
Frequency | 30kHz ~ 2.5GHz |
RF Type | Cellular, GSM, EDGE, CDMA |
Input Range | -70dBm ~ 10dBm |
Accuracy | ±1dB |
Voltage - Supply | 2.7 V ~ 5.25 V |
Current - Supply | 16mA |
Package / Case | 28-WFQFN Exposed Pad |
Image |
MAX2016ETI
MAXI
11050
0.24
CIS Ltd (CHECK IC SOLUTION LIMITED)
MAX2016ETI
MAXIX
182
1.6125
E-Core Electronics Co.
MAX2016ETI
MAXMI
2682
2.985
Belt (HK) Electronics Co
MAX2016ETI T
MXAIM
750
4.3575
WIN AND WIN ELECTRONICS LIMITED
MAX2016ETI
MAMIX
116085
5.73
Kunlida Electronics (HK) Limited